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JOURNAL OF ELECTRONIC PACKAGING


👁  28437 Views

 4 Reviews  

 Open Access      SCIE      Official Website     Submission Website
 

*Average Peer Review
>12 Week(s), or Invited contributions
*Competitiveness
Easy
CiteScore
6.6

CiteScore Rank
Subject Area Rank Percentile
Category: Engineering
Subcategory: Electrical and Electronic Engineering
231 / 1030
Category: Engineering
Subcategory: Mechanics of Materials
99 / 408
Category: Engineering
Subcategory: Electronic, Optical and Magnetic Materials
81 / 318
Category: Engineering
Subcategory: Computer Science Applications
270 / 1022



Country/Area of Publication
UNITED STATES
Publication Frequency
Quarterly
Publisher
American Society of Mechanical Engineers(ASME)

ISSN
1043-7398
E-ISSN
1528-9044
Year Publication Started
0

Self-citation (2025-2026)
4.50%
Annual Article Volume
43
Gold OA Percentage
2.05%


Open Access Info
APC APC Waiver Other Charges
N/A N/A N/A

Journal Aim & Scope
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.


Web of Science Quartiles
WOS Quartile: Q3

Quartiles By JIFCollectionQuartileRankPercentage
Category: ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ3229/369
Category: ENGINEERING, MECHANICALSCIEQ395/184
Quartiles By JCICollectionQuartileRankPercentage
Category: ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ3187/371
Category: ENGINEERING, MECHANICALSCIEQ277/184
*Crowdsourced data
  • Journals In The Same Subject Area
  • CiteScore Trends
  • Self Citation Trends
  • Annual Article Volume Trends
  • Journal Title h-index CiteScore
    PROCEEDINGS OF THE IEEE25060.30
    IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE32641.10
    IEEE TRANSACTIONS ON IMAGE PROCESSING24221.70
    IEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERING14822.70
    IEEE SIGNAL PROCESSING MAGAZINE15520.80
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY15418.10
    PROGRESS IN QUANTUM ELECTRONICS5819.70
    IEEE TRANSACTIONS ON FUZZY SYSTEMS17020.50
    EXPERT SYSTEMS WITH APPLICATIONS16217.00
    IEEE TRANSACTIONS ON INTELLIGENT TRANSPORTATION SYSTEMS11220.50
  • JOURNAL OF ELECTRONIC PACKAGING JOURNAL OF ELECTRONIC PACKAGING
    Predict CiteScore Trend:
    Steady Increase No Change Gradual Decline  Refresh
 
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