| Journal Profile | |
| Journal Title | IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING
(According to the latest JCR data, this journal is not indexed in the JCR.) |
| Journal Title Abbreviations | IEEE T ELECTRON PACK |
| ISSN | 1521-334X |
| h-index | N.A. |
| CiteScore | N.A.
|
| Self-Citation Ratio (2020-2021) | N/A |
| 期刊简介 | Lorem ipsum dolor sit amet, consectetur adipiscing elit. Sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur. Excepteur sint occaecat cupidatat non proident, sunt in culpa qui officia deserunt mollit anim id est laborum. |
| Official Website | http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6104 |
| Online Manuscript Submission | http://mc.manuscriptcentral.com/tepm-ieee |
| Open Access | No |
| Publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 |
| Subject Area | Engineering |
| Country/Area of Publication | UNITED STATES |
| Publication Frequency | Quarterly |
| Year Publication Started | 0 |
| Annual Article Volume | 0 |
| Gold OA文章占比 | |
| OA期刊相关信息 | |
| WOS期刊SCI分区 | |
| Indexing (SCI or SCIE) | |
| Link to PubMed Central (PMC) | https://www.ncbi.nlm.nih.gov/nlmcatalog?term=1521-334X%5BISSN%5D |
| Average Duration of Peer Review * | Authorized Data from Publisher:
Data from Authors: |
| Competitiveness * | Data from Authors: Easy |
| Useful Links | |
| *All review process metrics, such as acceptance rate and review speed, are limited to our user-submitted manuscripts. As such they may not reflect the journals' exact competitiveness or speed. |
